Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems) is an engineering study and reference text exploring structural engineering methods, sy...
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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems) is an engineering study and reference text exploring structural engineering methods, systems, or professional practice. It fits the interests of civil and structural engineering readers.
Topics referenced in the book listing: finite element analysis and engineering case studies.
- Author: Juan Cepeda-Rizo, Jeremiah Gayle, Joshua Ravich
- Publisher: CRC Press
- Publication date: December 29, 2021
- Available formats: Hardcover, Paperback
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